Publications 2010 https://tu-dresden.de/ing/elektrotechnik/ihm/hlt/forschung/publikationen-1/hlt_2010 https://tu-dresden.de/logo.png Publications 2010 21 bis 30 von 32 EinträgenWojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.: Electrical Evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers. In: AMC 2010, Albany, N.Y. 3.-6.Oct. 2010) in Microelectronic Engineering, article submitted (2010)Niese, S.; Hecker, M.; Liske, R.; Ritz, Y.; Zschech, E.; Wojcik, H.; Bartha, J.W.; Wud, Z.; Hod, P.S.: Assessment Of Mechanical Properties Of Nanoscale Structures For Microprocessor Manufacturing . In: 11th International Workshop on Stress-Induced Phenomena in Metallization April 12 - 14, 2010, Dresden Poster (2010)Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Liske, R.; Wenzel, C.; Bartha, J.W.: Evaluation of novel Ru-W(-N) films as Cu diffusion barriers for sub 32nm BEOL technology . In: Nanofair 2010, Dresden Poster (2010)Wojcik, H.; Merkel, U.; Jahn, A.; Richter, K.; Junige, M.; Klein, C.; Gluch, J.; Albert, M.; Munnik, F.; Wenzel, C.; Bartha, J.W.: Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements. In: Microelectronic Engineering, In Press, Corrected Proof, Available online 11 July 2010 (MAM 2010 als Poster) (2010)Schumacher, H.; Künzelmann, U.; Bartha, J.W.: Characterisation of Surface Processes during Oxide CMP by in situ FTIR Spectroscopy with Microstructured Reflection Elements at Silicon Wafers. In: Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics, MRS Spring Meeting 2010, San Francisco, CA, 5. - 7. April 2010 Materials Research Society - Symposium Proceedings, 1249 (2010), S. 135–140Estel, K.; Künzelmann, U.; Bartha, J.W.; Mayer, E.-P.; Barthel, H.: Influence of Ionic Strength and pH-Value on the Silicon Dioxide Polishing Behaviour of Slurries based on Pure Silica Suspensions. In: Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics, MRS Spring Meeting 2010, San Francisco, CA, 5. - 7. April 2010 Materials Research Society - Symposium Proceedings, 1249 (2010), S. 97–102Künzelmann, U.; Schumacher, H.; Bartha, J.W.: In situ-ATR-FTIR-Untersuchungen zur Wirkungsweise von Additiven in TSV-Cu-Elektrolyten. In: Industriepartnersymposium, Dresden, 30. Sept. 2010 Poster (2010)Estel, K.; Künzelmann, U. ; Bartha, J.W.; Mayer, E.-P.; Barthel, H.: Influence of Ionic Strengths and pH-Values of Model-Slurries for Chemical Mechanical Silicon Dioxide Polishing with different Nanodispersed Pure Silica Suspensions. In: Nanofair 2010, Dresden, 6.-7. Juli 2010 Poster (2010)Schumacher, H.; Künzelmann, U.; Vasilev, B.; Eichhorn, K.-J.; Bartha, J.W.: Applications of Microstructured Silicon Wafers as Internal Reflection Elements in Attenuated Total Reflection Fourier Transform Infrared Spectroscopy. In: Applied Spectroscopy 64 (2010), Nr. 9, S. 1022–1027Geidel, M.; Knaut, M.; Albert, M.; Bartha, J.W.: In-situ XPS study on the growth of ultra-thin Al-O and Ti-O based films with atomic layer deposition. In: E-MRS 2010 Spring Meeting in Strasbourg, 07.06.2010-11.06.2010 Poster (2010)Zurück 1 2 3 4 WeiterDiese Informationen werden vom Vorgängersystem FIS bereitgestellt.