Offers and services
The techniques and technologies of microelectronics, microsystems technology and sensor technology available at the Chair of Nanoelectronics are also available to employees of the TU Dresden and institutions or companies outside the TU Dresden. The focus is on the development and realization of customer-specific solutions.
These research services are illustrated using a few examples:
Wafer coatings (oxidation, PECVD, ALD and PVD processes for the production of functional layers and layer systems, diffusion barriers, metallization of various applications)
Layer structuring (chemical wet and dry etching)
Abrasive cutting of various substrates (max. 200mm diameter) and substrate materials (Si, sapphire, glass)
Additive and subtractive wiring technologies (damascene structuring)
Wafer bumping
Si deep etching for MEMS, MOEMS and microfluidics
X-ray nanolenses
Thin film capacitors
Electrical measurement techniques (C-V, I-V, breakdown, TVS, characterization of solar cells) e.g. vacuum probers for humidity and heat tests
Focused ion beam
At the beginning of such work there is an intensive discussion and consultation on the objectives and the realization possibilities. If necessary, preliminary tests are carried out to minimize the risk of failure. This is usually followed by a binding offer for the costs, which are made up of the actual costs and a university surcharge. The General Terms and Conditions of TU Dresden apply. The research services are carried out to the best of our knowledge, but we cannot accept any liability for the results.
Further information and inquiries: