Dr. Marko Swoboda

2023

• Method of Forming a Semiconductor Device Including an Absorption LayerSchulze, H., Draghici, M., Piccin, M. & Swoboda, M. D., 23 Mar 2023, IPC (International Patent Classification) H01L 29/ 06 A I, United States Patent and Trademark Office (PTO), Patent No. US2023092013, 16 Sep 2022, Priority date 23 Sep 2021, Priority No. DE202110124636Research output: Intellectual Property > Patent application/Patent
• Method for splitting semiconductor wafersBeyer, C., Santos Rodriguez, F. J., Schulze, H. & Swoboda, M. D., 5 Jan 2023, IPC (International Patent Classification) H01L 29/ 16 A I, United States Patent and Trademark Office (PTO), Patent No. US2023005794, 9 Dec 2020, Priority date 9 Dec 2020, Priority No. US202017781585Research output: Intellectual Property > Patent application/Patent

2022

• Verfahren zum Aufteilung eines HalbleiterwerkstücksBernard, B., Binter, A., Swoboda, M. D., Graf, H., Rieske, R., Stefenelli, M. & Ullrich, A., 2 Nov 2022, IPC (International Patent Classification) H01L 21/ 78 A I, European Patent Office (EPO), Patent No. EP4084054, 22 Apr 2022, Priority date 10 Mar 2022, Priority No. US202217691763Research output: Intellectual Property > Patent application/Patent

2021

• Method for separating a solid-state layer from a solid-state materialRieske, R., Beyer, C., Guenther, C., Richter, J. & Swoboda, M. D., 30 Sep 2021, IPC (International Patent Classification) B28D 5/ 00 A I, United States Patent and Trademark Office (PTO), Patent No. US2021299910, 9 Jun 2021, Priority date 9 Jun 2021, Priority No. US202117343219Research output: Intellectual Property > Patent application/Patent
• Method for Thinning Solid-Body Layers Provided with ComponentsRieske, R., Swoboda, M. & Richter, J., 22 Jul 2021, IPC (International Patent Classification) H01L 29/ 16 A I, United States Patent and Trademark Office (PTO), Patent No. US2021225709, 14 Sep 2018, Priority date 14 Sep 2018, Priority No. WO2018EP74893Research output: Intellectual Property > Patent application/Patent
• Solid Body and Multi-Component ArrangementDrescher, W., Swoboda, M. D., Rieske, R., Beyer, C. & Richter, J., 22 Jul 2021, IPC (International Patent Classification) H01L 21/ 324 A I, United States Patent and Trademark Office (PTO), Patent No. US2021225659, 22 Mar 2021, Priority date 22 Mar 2021, Priority No. US202117207894Research output: Intellectual Property > Patent application/Patent
• Method for forming a crack in an edge region of a donor substrateSwoboda, M. D., Beyer, C., Schilling, F. & Richter, J., 15 Jul 2021, IPC (International Patent Classification) H01L 31/ 18 A I, United States Patent and Trademark Office (PTO), Patent No. US2021213643, 26 Mar 2021, Priority date 26 Mar 2021, Priority No. US202117214256Research output: Intellectual Property > Patent application/Patent
• Method for Reducing the Thickness of Solid-State Layers Provided with ComponentsSwoboda, M., Rieske, R., Beyer, C. & Richter, J., 1 Jul 2021, IPC (International Patent Classification) B23K 103/ 00 A N, United States Patent and Trademark Office (PTO), Patent No. US2021197314, 15 Jan 2018, Priority date 15 Jan 2018, Priority No. WO2018EP50902Research output: Intellectual Property > Patent application/Patent
• Methods for processing a semiconductor substrateSchustereder, W., Breymesser, A., Draghici, M., Hoechbauer, T. F. W., Lehnert, W., Schulze, H. & Swoboda, M. D., 27 May 2021, IPC (International Patent Classification) H01L 21/ 768 A I, United States Patent and Trademark Office (PTO), Patent No. US2021159115, 25 Nov 2020, Priority date 27 Nov 2019, Priority No. DE201910132158Research output: Intellectual Property > Patent application/Patent

2020

• Method for Producing Wafers with Modification Lines of Defined OrientationSwoboda, M., Rieske, R., Beyer, C. & Richter, J., 10 Dec 2020, IPC (International Patent Classification) H01L 21/ 78 A I, United States Patent and Trademark Office (PTO), Patent No. US2020388538, 15 Jan 2018, Priority date 15 Jan 2018, Priority No. WO2018EP50897Research output: Intellectual Property > Patent application/Patent