Dr. Marko Swoboda

2020

• Production Facility for Separating Wafers from Donor SubstratesSwoboda, M., Beyer, C., Rieske, R., Ullrich, A. & Richter, J., 13 Aug 2020, IPC (International Patent Classification) B28D 5/ 00 A I, United States Patent and Trademark Office (PTO), Patent No. US2020254650, 7 Aug 2018, Priority date 7 Aug 2018, Priority No. WO2018EP71438Research output: Intellectual Property > Patent application/Patent
• Device and Method for Applying Pressure to Stress-Producing Layers for Improved Guidance of a Separation CrackSwoboda, M., Rieske, R., Beyer, C. & Richter, J., 9 Jul 2020, IPC (International Patent Classification) B28D 5/ 00 A I, United States Patent and Trademark Office (PTO), Patent No. US2020215648, 10 Aug 2018, Priority date 10 Aug 2018, Priority No. WO2018EP71814Research output: Intellectual Property > Patent application/Patent
• Method for Modifying Substrates Based on Crystal Lattice Dislocation DensityBeyer, C., Richter, J., Rieske, R., Swoboda, M. & Ullrich, A., 13 Feb 2020, IPC (International Patent Classification) H01L 21/ 78 A I, United States Patent and Trademark Office (PTO), Patent No. US2020051831, 6 Aug 2019, Priority date 7 Aug 2018, Priority No. DE20181006238Research output: Intellectual Property > Patent application/Patent
• Verfahren zum Abtrennen von Festkörperschichten von Kompositstrukturen aus SiC und einer metallischen Beschichtung oder elektrischen BauteilenRichter, J. & Swoboda, M., 22 Jan 2020, IPC (International Patent Classification) B23K 103/ 16 A N, European Patent Office (EPO), Patent No. EP3597352, 28 Mar 2019, Priority date 4 May 2018, Priority No. DE20181003675Research output: Intellectual Property > Patent application/Patent

2019

• Method and device for producing planar modifications in solid bodiesRieske, R., Beyer, C., Richter, J., Swoboda, M. & Guenther, C., 5 Dec 2019, IPC (International Patent Classification) B28D 5/ 00 A I, United States Patent and Trademark Office (PTO), Patent No. US2019366586, 12 Dec 2016, Priority date 12 Dec 2016, Priority No. WO2016EP80667Research output: Intellectual Property > Patent application/Patent
• Method for Separating Solid Body Layers from Composite Structures Made of SiC and a Metallic Coating or Electrical ComponentsRichter, J. & Swoboda, M., 7 Nov 2019, IPC (International Patent Classification) B23K 26/ 53 A I, United States Patent and Trademark Office (PTO), Patent No. US2019337100, 3 May 2019, Priority date 4 May 2018, Priority No. DE20181003675Research output: Intellectual Property > Patent application/Patent
• Laser Conditioning of Solid Bodies Using Prior Knowledge from Previous Machining StepsSwoboda, M., Rieske, R., Richter, J. & Schilling, F., 3 Oct 2019, IPC (International Patent Classification) H01L 21/ 78 A I, United States Patent and Trademark Office (PTO), Patent No. US2019302725, 13 Jul 2017, Priority date 13 Jul 2017, Priority No. WO2017EP67737Research output: Intellectual Property > Patent application/Patent
• Combined laser treatment of a solid body to be splitRieske, R., Swoboda, M. & Richter, J., 4 Apr 2019, IPC (International Patent Classification) C03B 33/ 09 A I, United States Patent and Trademark Office (PTO), Patent No. US2019099838, Priority date 22 Mar 2017, Priority No. WO2017EP56789Research output: Intellectual Property > Patent application/Patent
• Polymer hybrid material for use in a splitting methodBeyer, C., Richter, J. & Swoboda, M., 7 Mar 2019, IPC (International Patent Classification) H01L 21/ 304 A I, United States Patent and Trademark Office (PTO), Patent No. US2019071552, 23 Mar 2017, Priority date 23 Mar 2017, Priority No. WO2017EP56945Research output: Intellectual Property > Patent application/Patent
• Cold split kerf-free wafering results for doped 4H-SiC boulesSwoboda, M., Rieske, R., Beyer, C., Ullrich, A., Gesell, G. & Richter, J., 2019, Silicon Carbide and Related Materials 2018. p. 10-13, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution