The goal of project A01 is to provide the mm-wave circuits needed in the wireless communication system of the HAEC Box, capable of data rates up to 100 Gbit/s over a carrier of about 200 GHz. This represents a tenfold data rate improvement over the currently available wireless communication hardware, which provides up to 10 Gbit/s over 60 GHz carrier frequencies.

While Phase I focused on the receiver and low-resolution analog-to-digital conversion (ADC), Phase II will be primarily devoted to the transmitter and 1 bit oversampled analog-to-digital and digital-to-analog conversion (DAC). In order to support the projection beyond 100 Gbit/s per link, mm-wave circuits at carrier frequencies beyond 200 GHz will be investigated.

Role within the CRC 912

© CRC 912

The project plays a central role within HAEC, as it is devoted to the development
of the mm-wave electronics of the wireless communication links. In addition to those required by direct
system-level integration, other projects cooperate at the device-modeling or
system-design levels:

• The wireless system will be designed at the hardware and software levels in cooperation with project A02 (Fettweis/Dörpinghaus/Fischer), in particular for aspects involving modulation, interfaces and overall perfomance specifications.
• Project A03 (Jorswieck) will receive estimations of the power consumtion of the mm-wave wireless front-end hardware.
• The architecture of the antenna array and  beamforming system will be designed in cooperation with project A05 (Plettemeier).
• Work on the technology evaluation will require cooperation with project A06 (Schröter), at the transistor level for evaluation and improvement of active-device models,
• and with project A07 (Ellinger), at the circuit and system level with large overlaps in terms of analog/RF IC design and shared use of the measurement laboratory.
• All circuits developed within project A01 will be embedded and integrated in the wireless communication system, consisting of multiple dies and antenna arrays; this will require frequent cooperation with project A10 (Bock) for the development and characterization of a suitable mm-wave packaging technology.

Staff

Principal Investigator

• Prof. Dr. sc. techn. habil. Dipl. Oec. Frank Ellinger

Post Doc

• Dr.-Ing. Corrado Carta

PhD Students

• Sami Rehmann
• Mengqi Cui

former Staff

• Dipl.-Ing. David Fritsche