Control of Solder Flow during Brazing Using Laser Interference–Structured Surfaces
Funded by: Industrielle Gemeinschaftsforschung (IGF)
Running time: 01.07.2025 - 30.06.2027
Brazing is one of the most important joining technologies for creating a material bond connection. Due to its high profitability, even with low manufacturing costs and high quantities, this process is attractive for small and medium-sized companies.
Commonly, the slit solder joint technology is used. For high quality of the join, the solder flow has to be controlled depending on the requirements and conditions. The solder flow is influenced by the width of the slit and the surface tension of the solder. These parameters define the capillary forces.
The state of the art has shown the possibility to control the soldering flow by functionalization of the surface by micro structuring the surface . Additionally, the chemistry of the surface can be tuned, for instance by local oxidation.
The objective of the project is to develop and understand how functionalized surfaces control the solder flow and therefore to improve the wettability of materials that are difficult to solder. This enables a deep understanding of the laser process and the relationship between surface topography and chemistry for explaining solder flow. The generalization of the results will be summarized in a way that is accessible to industry. In addition, a catalogue of instructions will be included and built a basis for future process development, especially for small and medium-sized companies. Furthermore, the limits of brazing will be expanded and new joining technologies can be investigated.
The project is in cooperation with the Chair of Joining Technology and Assembly of TU Dresden and is supported by project sponsorship IGF.
Contact:
© Vanessa Groß
Vanessa Groß
M. Eng.
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