Aug 15, 2024
First "Semiconductor Talent Incubation Program" students return from Taiwan – and the next group is already to go
Returned and future STIPT participants at a welcome and networking event at TU Dresden.
Less than one year after the signing of the trilateral agreement between the Free State of Saxony, TUD Dresden University of Technology and the semiconductor group, Taiwan Semiconductor Manufacturing Company Limited (TSMC), the first students from Saxon universities have now returned from Taiwan. They completed a six-month study visit, which included a two-month internship in Taiwan as part of the innovative Semiconductor Talent Incubation Program Taiwan (STIPT).
From left to right: Saxony's Science Minister Sebastian Gemkow, TUD's Chief Officer Technology Transfer and Internationalisation, Prof. Ronald Tetzlaff, and TUD Rector Prof. Ursula Staudinger at the welcome and networking event.
Today (August 15, 2024), the newly returned students were welcomed back by Saxony's Minister of Science Sebastian Gemkow, TUD Rector Prof. Ursula Staudinger, TUD's Chief Officer Technology Transfer and Internationalization, Prof. Ronald Tetzlaff, Dr. Josef Goldberger, Head of the Saxon Science Liaison Office in Taiwan, as well as representatives of the LEONARDO-OFFICE SAXONY and the International Office of TUD. Under STIPT, the Free State of Saxony, TUD, and TSMC work closely together to prepare STEM students from several universities in Saxony for careers as highly skilled professionals in the semiconductor industry. As part of their studies, the students will complete a semester with teaching on the semiconductor industry at the National Taiwan University (Taipei), combined with practical training at the Newcomer Training Center & Fab at TSMC (Taichung).
More than 120 students applied for this stay abroad in 2023, of which 30 were selected for the first trip. The young talents study electrical engineering, computer science, physics, and chemistry at TU Dresden, Leipzig University of Applied Sciences, and TU Bergakademie Freiberg. The new cohort comprises students from TUD Dresden University of Technology, University of Applied Sciences Dresden, Chemnitz University of Technology, Mittweida University of Applied Sciences, Zittau/Görlitz University of Applied Sciences, TU Bergakademie Freiberg, Leipzig University, Saxony University of Cooperative Education (Glauchau), and Leipzig University of Applied Sciences.
Today, Minister of Science Sebastian Gemkow thanked TU Dresden and the LEONARDO-OFFICE SAXONY for their committed and expert cooperation in setting up the structures for the STIPT program and announced additional support from the Free State of Saxony for future programs. TUD Rector Prof. Ursula Staudinger expressed her gratitude to all involved and emphasized the significance of this support , without which the financing of the scholarships provided to the students and the organization of the Saxon Science Liaison Office in Taiwan as the main local point of contact would not be possible.
Dr. Josef Goldberger, Head of the Saxon Science Liaison Office in Taiwan, in conversation with returning and upcoming STIPT participants.
The Chief Officer Technology Transfer and Internationalization of TUD, Prof. Ronald Tetzlaff, added: “I am particularly impressed by the highly professional collaboration with the Taiwanese universities and partners. In response to the urgent need for specialists in the semiconductor industry as the key to future economic development both here in Saxony and in Taiwan, we are breaking new ground in a close partnership between scientific institutions, with TSMC and also between the Free State of Saxony and Taiwan.”
Planning for the second group of student is already underway. 50 applicants were selected from around 120 applications from the aforementioned Saxon universities. At TSMC's request, the students will complete the STIPT program in two groups. 30 students will travel to Taiwan in 2025 Summer Semester and 20 will travel in the 2025/2026 Winter Semester.
Contact:
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