Published Journals https://tu-dresden.de/ing/elektrotechnik/ihm/hlt/forschung/publikationen-1/journale https://tu-dresden.de/logo.png Published Journals 91 bis 100 von 107 EinträgenSchmidt, D.; Strehle, S.; Albert, M.; Hentsch, W.; Bartha, J.W.: Top Injection Reactor Tool with in situ Spectroscopic Ellipsometry for growth and characterization of ALD thin films. In: Microelectronic Engineering 85 (2008), S. 527–533Richter, K.; Zschätzsch, G.; Bartha, J.W.: Positve etch profiles in silicon with improved pattern quality. In: Plasma Process. Polym. 4 (2007)K., Richter; C., Kubasch; J.W., Bartha: Micro-patterned silicon surfaces for biomedical devices. In: Plasma Process. Polym. 4 (2007), S. 411–415D., Reitz; J., Thomas; H., Schmidt; S., Menzel; K., Wetzig; M., Albert; J.W., Bartha: Dama¬scene technique applied to surface acoustic wave devices. In: J. Va. Sci. Technol. 25 (2007), S. 271–276S., Menzel; D., Schmidt: Oberflächenwellen-Strukturen in Cu-Damaszentechnologie. In: Vakuum in der Forschung und Praxis 19 (2007), S. 4Hellriegel, R.; Albert, M.; Hintze, B.; Winzig, H.; Bartha, J.W.: Remote plasma etching of titanium nitride using NF3/argon and chlorine mixtures for chamber clean applications. In: Microelectronic Engineering 84 (2007), S. 37–41Reitz, D.; Heuer, H.; Baunack, S.; Hübner, R.; Hoffmann, V.; Menzel, S.; Wenzel, C.; Wetzig, K.: Investigation of a Ta-Si-O/Ta-Si-N bilayer system for embedded SAW finger structures. In: Microelectronic Engineering 82 82 (2006), S. 301–306Hübner, R.; Hecker, M.; Mattern, N.; Hoffmann, V.; Wetzig, K.; Heuer, H.; Wenzel, C.; Engelmann, H.-J.; Gehre, D.; Zschech, E.: Effect of nitrogen content on the degradation mechanisms of thin Ta-Si-N diffusion barriers for Cu metallization. In: Thin Solid Films 500 500 (2006), S. 259–267Heuer, H.; Wenzel, C.; Herrmann, D.; Hübner, R.; Chang, Z.L.; Bartha, J.W.: Thin tantalum-silicon-oxygen/tantalum-silicon-nitrogen films as high efficiency humidity diffusion barriers for solar cell encapsulation. In: Thin Solid Films 515 (2006), S. 1612–1617Reitz, D.; Heuer, H.; Baunack, S.; Hübner, R.; Hoffmann, V.; Menzel, S.; Wenzel, C.; Wetzig, K.: Investigation of a Ta–Si–O/Ta–Si–N bilayer system for embedded SAW finger structures. In: Microelectronic Engineering 82 (2005) (2005), S. 301–306Zurück 2 3 4 5 6 7 8 9 10 11 WeiterDiese Informationen werden vom Vorgängersystem FIS bereitgestellt. Journals Archives: 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005