Abschlussarbeiten - Diplom
Untersuchungen von elektrochemisch abgeschiedenen Zinn-Blei- und Zinn-Silber-Lotkontakte in 3D-Chip-Stapeln
Art der Abschlussarbeit
Diplomarbeit
Autoren
- Yang, Jiye
Betreuer
- Prof. Dr. rer. nat. Johann Wolfgang Bartha
- Dipl.-Ing. Sebastian Killge
- Dr. rer. nat. Christian Wenzel
Abstract
In the past decades, the development of semiconductor industry followed the Moore's Law, which states that the complexity of integrated circuits is regularly doubled. In September 2007, the Semiconductor Industry Association (SIA) announced that the industry can be faced with the limit in reducing the size of the transistors in the following 10 or 15 years for physical reasons. Therefor the idea of "More than Moore" has been proposed to increase the density of integration through three-dimensional integrated circuits in the semiconductor industry.
Instead of further reducing the size of transistors, the working speed and the integration rate of electronic components can be significantly increased by building 3D architectures. In 3D-Chip-Stack, Flip-Chip-Solder-Contact is frequently used for contact-making. Solders with different melting temperatures are often used to prevent the re-melting of already existing solder contacts during contact-making in 3D-Chip-Stack.
In this work, researches are made on the melting and re-melting behavior, the phase formation and the composition of the electrochemically deposited tin-lead and tin-silver solder contacts of different melting temperatures. Metallographic analysis, focused ion beam (FIB), energy dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) are applied for characterization. At last electrical connections are produced through solder contact. The result can show whether the flux-free soldering works and the optimal process parameters can be determined.
Instead of further reducing the size of transistors, the working speed and the integration rate of electronic components can be significantly increased by building 3D architectures. In 3D-Chip-Stack, Flip-Chip-Solder-Contact is frequently used for contact-making. Solders with different melting temperatures are often used to prevent the re-melting of already existing solder contacts during contact-making in 3D-Chip-Stack.
In this work, researches are made on the melting and re-melting behavior, the phase formation and the composition of the electrochemically deposited tin-lead and tin-silver solder contacts of different melting temperatures. Metallographic analysis, focused ion beam (FIB), energy dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) are applied for characterization. At last electrical connections are produced through solder contact. The result can show whether the flux-free soldering works and the optimal process parameters can be determined.
Schlagwörter
-
Berichtsjahr
2017