Abschlussarbeiten - Master
Development of highly transparent ITO coatings using pulsed-DC reactive sputtering and optical emission spectroscopy
Art der Abschlussarbeit
Master
Autoren
- Zhang, Yue
Betreuer
- Prof. Dr. rer. nat. Johann Wolfgang Bartha
- Dr.-Ing Matthias Albert
Weitere Betreuer
Dr. B. Tinkham (Solayer GmbH)
Abstract
Tin-doped indium oxide (ITO) films were deposited on large scale glass substrates by reactive magnetron sputtering using an indium-tin alloy target under different process conditions. Depositions were carried out in the “transition regions” between the metallic and the reactive (oxide) sputter modes. In order to improve the process reproducibility, a reactive sputtering gas controller was built in and the plasma emission monitoring method was selected pairing with the indium plasma emission filter so that the oxygen flow rate can be monitored more accurately.
ITO films deposited with continuous DC magnetron sputtering and pulsed DC magnetron sputtering method were investigated. Compared with a continuous DC process, adding pulse to the power supply extended the process window, and the layers were more dense and stable. The deposition rate increased with increasing sputter power, for 1.4 KW, specifically, the process window became larger as well. ITO layers grown at relatively lower pressure etch slower and are thus likely more dense and stable. For the same process recipe, better coating with lower sheet resistance and higher transmittance in the visible light range can be made when the substrate is heated. By adding hydrogen to the process gas, the resistivity became stable regardless of the layer thickness (from 40nm to 180nm). Therefore, the process was more stable compared with no hydrogen in the process gas. After chosen some layers for the FLA treatment, the layers became more transparent and conductive. However, the optimum energy density is different for each layer.
ITO films deposited with continuous DC magnetron sputtering and pulsed DC magnetron sputtering method were investigated. Compared with a continuous DC process, adding pulse to the power supply extended the process window, and the layers were more dense and stable. The deposition rate increased with increasing sputter power, for 1.4 KW, specifically, the process window became larger as well. ITO layers grown at relatively lower pressure etch slower and are thus likely more dense and stable. For the same process recipe, better coating with lower sheet resistance and higher transmittance in the visible light range can be made when the substrate is heated. By adding hydrogen to the process gas, the resistivity became stable regardless of the layer thickness (from 40nm to 180nm). Therefore, the process was more stable compared with no hydrogen in the process gas. After chosen some layers for the FLA treatment, the layers became more transparent and conductive. However, the optimum energy density is different for each layer.
Schlagwörter
-
Berichtsjahr
2015