Abschlussarbeiten - Master
Photoresist smoothening mechanisms observed during different plasma treatments
Art der Abschlussarbeit
Master
Autoren
- Sakthikumar, Suseendharan
Betreuer
- Prof. Dr.-Ing. Andreas Richter
- Prof. Dr.-Ing.habil. Uwe Marschner
Weitere Betreuer
Prof. Richter, Dr. Lazzarino, Dr. Mao, M.Sc. Paolillo (IMEC)
Abstract
The semiconductor industry is driven by the continuous shrinking of size of the devices thereby reducing the manufacturing cost and enhancing the performance. However, with the decrease in the feature size parallelly reduces the process windows imposing the extremely tight requirements in parameters such as Line Edge Roughness (LER), Line Width Roughness (LWR) and Critical Dimension (CD) .One high potential roadblock that can affect the progress of the technology node is the Line Edge Roughness (LER) and Line Width Roughness (LWR). It is considered as the significant problem as it has an influence over the electrical parameters that affects the device performance. With the advent of 5 nm and 3 nm technology node, achieving the stringent requirements of the Line Edge Roughness (LER) and Line Width Roughness (LWR) is even more challenging. Though there are various post lithographic solutions proposed to overcome the roughness of the features, there is always a gap between the target and the achieved roughness value after the final pattern transfer. Compared to the other generation technology nodes, the industrial requirements for 5 nm and 3 nm technology node call for a highly efficient strategy to alleviate the roughness to achieve the target Line Width Roughness (LWR), Line Edge Roughness (LER). Employing the smoothening strategies in etching has found to yield attractive results. Though various research works has been documented regarding the smoothening strategies at etch level, the impact of multilayer stacks with different underlayers, effect of spacer insertion, effect of the plasma treatment, use of negative voltage during the plasma treatment, impact of Quasi Atomic Layer Etching (QALE) over the roughness deserves to be understood and explored deeper than the usual attention they gained. This thesis focusses on the quantifying and characterizing various smoothening mechanisms induced by plasma treatment and the pattern transfer, in order to identify the most suited material properties and the process conditions to achieve the target roughness value.
Schlagwörter
-
Berichtsjahr
2018