Parallel Machine Scheduling in Semiconductor Backend Manufacturing

As part of the backend process in semiconductor manufacturing, the integrated circuit relates to its packaging. Hence, it needs to be planned which order is processed on which tool, considering relevant order characteristics e.g., due date and customer priority. So far, backend production is mostly controlled by simple heuristics such as dispatching rules, therefore, optimization potential remains for a more streamlined wire bonding process.
Within this presentation, I will work in a real case study of one of SYSTEMA’s manufacturing partners to enable job scheduling of wire bonding processes, in which the problem can be stated as a parallel machine scheduling problem. The underlying research question is how to establish a scheduling model for a large-scale use case and to what extent the untapped optimization potential can be harnessed by advanced production planning. I will build up on SYSTEMA’s scheduling module and will make use of a constraint programming approach. By that, this research project will take up on the transfer of a formal optimization model into industrial practice.

(Presentation of research project)