Publications 2011 71 bis 74 von 74 EinträgenStrehle, S.; Menzel, S.; Wetzig, K.; Bartha, J.W.: Microstructure of electroplated Cu(Ag) alloy thin films. In: Thin Solid Films 519 (2011), Nr. 11, S. 3522–3529Strehle, S.; Schmidt, D.; Albert, M.; Bartha, J.W.: Growth of the Initial Atomic Layers of Ta-N Films During Atomic Layer Deposition on Silicon-Based Substrates. In: Chemical Vapor Deposition 17 (2011), S. 37–44Ispas, A.; Peipmann, R.; Adolphi, B.; Efimov, I.; Bund, A.: Electrodeposition of pristine and composite poly(3,4-ethylenedioxythiophene) layers studied by electro-acoustic impedance measurements. In: Electrochimica Acta 56 (2011) (2011), S. 3500–3506Teng, L.; Kirchner, R.; Plötner, M.; Jahn, A.; He, J.; Hagemann, F.; Fischer, W.-J.: Fabrication of Sub-500 nm Source and Drain Electrodes for Organic Field Effect Transistors using UV Nanoimprint Lithography with Low-Cost Silicon Mold and Lift-Off Process. In: Proc. 3. GMM-Workshop Mikro-Nano-Integration, 2.-4.3.2011, Stuttgart GMM Fachbericht 68 (2011), S. 84–89Zurück 1 2 3 4 5 6 7 8 Diese Informationen werden vom Vorgängersystem FIS bereitgestellt.