NanoCuNi

Abstract

NanoCuNi (BMBF FKZ: 03X0117E) is the (further) development of a coating process for thin copper and nickel bonding wires. Purpose of this coating technique is to accomplish an electric contacting of electronic components with this bonding wires at room temperature and without further protective measures. If possible, monometallic systems (wire bondpad), in particular for SiC-components, should be realized for that. A higher reliability compared to multi-metal systems can be accomplished. In cooperation with various small and medium-sized businesses (project partners) and the FhG IWM Halle, the modified wires are tested, qualified and proved under industrial conditions.