Publikationen der Professur für Halbleitertech­nik

151 bis 160 von 284 Einträgen

Leszczynska, B.; Strobel, C.; Albert, M.; Zimmermann, T.; Kuske, J.; Bartha, J.W.: Dynamic VHF-PECVD technique for flexible substrate coating. In: Proc. of the 54th Annual SVC Technical Conference, Chicago 2011 (2011)

Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.: Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers. In: Microelectronic Engineering, Available online 27 May 2011 (2011)

Wojcik, H.; Merkel, U.; Jahn, A.; Richter, K.; Junige, M.; Klein, C.; Gluch, J.; Albert, M.; Munnik, F.; Wenzel, C.; Bartha, J.W.: Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements. In: Microelectronic Engineering 88 (2011), Nr. 5, S. 641–645

Wojcik, H.; Kaltofen, R.; Krien, C.; Merkel, U.; Wenzel, C.; Bartha, J.W.; Friedemann, M.; Adolphi, B.; Liske, R.; Neumann, V.; Geidel, M.: Investigations on Ru-Mn films as plateable Cu diffusion barriers. In: In: Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International, 2011 (2011), S. 1–3

Bartha, J.W.; Knaut, M.; Junige, M.; Geidel, M.; Albert, M.: In situ monitoring for ALD process control. In: AVS 11th International Conference on Atomic Layer Deposition : June 26 – 29, 2011, Cambridge, Massachusetts, USA. Boston, 2011 (2011)

Junige, M.; Knaut, M.; Geidel, M.; Riedel, S.; Endler, I.; Wojcik, H.; Albert, M.; Merkel, U.; Bartha, J.W.: Characterization of ruthenium ALD and PVD thin films for in-situ process control by spectroscopic ellipsometry. In: 6th Workshop Ellipsometry : February 21-24, 2011 Berlin, Germany. Berlin, 2011 (2011)

Junige, M.; Knaut, M.; Geidel, M.; Albert, M.; Bartha, J.W.: In situ ellipsometric investigations during the ALD growth of Ru. In: AVS 11th International Conference on Atomic Layer Deposition : June 26 – 29, 2011, Cambridge, Massachusetts, USA. Boston, 2011 (2011)

Junige, M.; Geidel, M.; Knaut, M.; Albert, M.; Bartha, J.W.: Monitoring atomic layer deposition processes in situ and in real-time by spectroscopic ellipsometry. In: IEEE 2011 Semiconductor Conference Dresden : September 27 to 28, 2011 - Dresden, Germany. Dresden, 2011 (2011)

Strobel, C.; Leszczynska, B.; Albert, M.; Bartha, J.W.; Zimmermann, T.; Kuske, J.: Dynamic High Rate Deposition of Microcrystalline Silicon with Very High Excitation Frequencies (80-150MHz) Using Linear Plasma Sources. In: Proceedings of 26th European Photovoltaic Solar Energy Conference and Exhibition (2011) (2011), S. 2499–2501

Kubasch, C.; Bartha, J.W.: Fundamental relationship between capacitance-time measurements and gravimetric measurements for water absorption in a low-k dielectric. In: Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International (2011), S. 1–3

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Martin Knaut
Letzte Änderung: 05.10.2022