Publications

2011

• Transactional Memory for Dependable Embedded SystemsFetzer, C. & Felber, P., 2011, 5 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Transactional Memory for Dependable Embedded Systems (Poster)Fetzer, C., Wamhoff, J. & Felber, P., 2011, 1 p.Research output: Contribution to conferences > Poster
• Transmission of Renewable Energies under Extreme ConditionsDreier, S., Großmann, S., Moustafa, G. & Hildmann, C., 2011Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Two new modalities for ARIAFranke, M., Voegler, J. & Weber, G., 2011, Proceedings of the Workshop on Accessible Design in the Digital World 2011 (ADDW-2011). p. 30-40, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Two poses synthesis of spatial linkages using similarity transformationBär, G., Modler, K., Ehlig, J. & Lin, S., 2011, 13th World Congress in Mechanism and Machine Science 2011. Vol. 1. p. 1247-1254Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Übersichtsgewinnung und Interaktionsmöglichkeiten in Planungsszenarien - Ein PraxisberichtLambeck, C., Winkler, K. & Fiebig, M., 2011, Wieder mehr Sehen! - Aktuelle Einblicke in die Technische VisualistikResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Übertragbarkeit singulärer MINT-Interesse-initiierender außerschulischer MaßnahmenLeonhardt, T., Brauner, P., Siebert, J. & Schroeder, U., 2011, Informatik in Bildung und Beruf - 14. GI-Fachtagung "Informatik und Schule - INFOS 2011 - Proceedings. Thomas, M. (ed.). Bonn: Gesellschaft fur Informatik (GI), p. 127-136, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Ultrasonic cutting of foods with inclined moving bladesArnold, G., Zahn, S., Legler, A. & Rohm, H., 2011, In: Journal of Food Engineering. p. 394-400Research output: Contribution to journal > Research article
• Ultra-thin wafer fabrication through dicing-by-thinningLandesberger, C., Scherbaum, S. & Bock, K., 2011, Ultra-thin Chip Technology and Applications. Springer New York, p. 33-43, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• UML is still inconsistent! How to improve OCL Constraints in the UML 2.3 SuperstructureWilke, C. & Demuth, B., 2011Research output: Contribution to conferences > Paper