Publications

2010

• Influence of nano silver filler content on properties of ink-jet printed structures for microelectronicsFalat, T., Felba, J., Moscicki, A., Smolarek, A., Bock, K. & Bonfert, D., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 5642899Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• The scaling effect on microstructure and creep properties of Sn-based soldersWiese, S., Mueller, M., Panchenko, I., Metasch, R., Roellig, M. & Wolter, K., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 5642825Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Experimentally based strategy for damage analysis of textile-reinforced composites under static loadingBöhm, R. & Hufenbach, W., 15 Sep 2010, In: Composites Science and Technology. 70, 9, p. 1330-1337, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Rule-Based Language for Complex Event Processing and ReasoningAnicic, D., Fodor, P., Rudolph, S., Stühmer, R., Stojanovic, N. & Studer, R., 1 Sep 2010, Web Reasoning and Rule Systems - Fourth International Conference. Hitzler, P. & Lukasiewicz, T. (eds.). Springer, Berlin [u. a.], p. 42-57, 16 p., (LNCS)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• cf2 Semantics RevisitedGaggl, S. A. & Woltran, S., 1 Sep 2010, Proceedings of the Third International Conference on Computational Models of Argument (COMMA 2010). Baroni, P., Cerutti, F., Giacomin, M. & Simari, G. R. (eds.). IOS Press, Vol. 216. p. 243-254, 12 p., (Frontiers in Artificial Intelligence and Applications)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Efficient compensation of delay variations in high-speed network-on-chip data linksHöppner, S., Walter, D., Eisenreich, H. & Schüffny, R., 1 Sep 2010, IEEE International Symposium on System on Chip (SoC). p. 55-58, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Non-intrusive Performance Analysis of Parallel Hardware Accelerated Applications on Hybrid ArchitecturesDietrich, R., Ilsche, T. & Juckeland, G., 1 Sep 2010, 2010 39th International Conference on Parallel Processing Workshops. Wiley-IEEE Press, p. 135-143, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• 3-dimensionale Drahtstrukturen für LeichtbauanwendungenKieselstein, E., Kieselstein, J., Walter, G., Weck, D., Gottwald, R., Adam, F., Stephani, G. & 2 others, Sep 2010Research output: Contribution to conferences > Presentation slides
• Acoustical optimization of railway running gear by simulation and experimentBeitelschmidt, M., Klotz, M. & Quarz, V., Sep 2010Research output: Contribution to conferences > Paper
• Development of a SIMPACK User Routine for Dynamic Light Rail Vehicle Gauging SimulationsZechel, G., Beitelschmidt, M. & Netter, H., Sep 2010, In:  Simpack news. 14, p. 13-15Research output: Contribution to specialist publication > Special issue article/Contribution