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Neumann, N.; Charania, S.; Killge, S.; al-Husseini, Z.; Henker, R.; Ellinger, F.; Bartha, J.W.; Plettemeier, D.: Modeling and characterization of optical TSVs . In: SPIE 10325, Optical Fibers and Their Applications 2017, 103250O, Optical Fibers and Their Applications 2017, Supraśl, Poland, Poland | January 23, 2017 (2017)

Schwille, C.; Schössler, T.; Schön, F.; Oettel, M.; Bartha, J.W.: Temperature dependence of the sticking coefficients of bis-diethyl aminosilane and trimethylaluminum in atomic layer deposition. In: J. Vac. Sci. Technol. A 35 , 01B119 (2017)

Schwille, M. C.; Schössler, T.; Barth, J.; Knaut, M.; Schön, F.; Höchst, A.; Oettel, M.; Bartha, J.W.: Experimental and simulation approach for process optimization of atomic layer deposited thin films in high aspect ratio 3D structures . In: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35, 01B118 (2017)

Henke, T.; Knaut, M.; Hossbach, C.; Geidel, M.; Albert, M.; Bartha, J.W.: Growth of aluminum oxide thin films with enhanced film density by the integration of in situ flash annealing into low-temperature atomic layer deposition . In: Surface & Coatings Technology 309 (2017), S. 600–608

Köckritz, T.; Luther, R.; Paschew, G.; Jansen, I.; Richter, A.; Jost, O.; Schönecker, A.; Beyer, E.: Full Polymer Dielectric Elastomeric Actuators (DEA) Functionalised with Carbon Nanotubes and High-K Ceramics . In: Micromachines 2016, 7(10), 172 (2016)

Slowik, I.; Kronenberg, N. M.; Franke, M.; Fischer, A.; Richter, A.; Gather, M. C.; Leo, K.: Elastomer based electrically tunable optical microcavities. In: Applied Physics Letters 109, 171104 (2016) (2016)

Frank, P.; Schreiter, J.; Häfner, S.; Paschew, G.; Voigt, A.; Richter, A.: Integrated Microfluidic Membrane Transistor Utilizing Chemical Information for On-Chip Flow Control. In: PLOS ONE, August 29, 2016 (2016)

Killge, S.; Neumann, N.; Plettemeier, D.; Bartha, J.W.: Optical Through-Silicon Vias. In: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.) (2016), S. 221–234

Killge, S.; Neumann, V.; Bartha, J.W.: Copper-Based TSV: Interposer. In: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.) (2016), S. 9–28

Killge, S.; Charania, S.; Bartha, J.W.: Introduction to Electrical 3D Integration. In: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.) (2016), S. 3–7

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Martin Knaut
Letzte Änderung: 29.05.2019