Publications

221 bis 230 von 284 Einträgen

Naumann, A.; Kronholz, S.; Mowry, A.; Ostermay, I. ; Bierstedt, H. ; Trui, B.; Dittmar, K.; Kuecher, P.; Bartha, J.W.; Kammler, T.: Novel anhanced stressors with graded encapsulated SiGe embedded in the source and drain areas. In: Materials Science and Engineering B 154-155 (2008), S. 95–97

Gorbatenko, S.; Novodvorsky, O.A.; Panchenko, V.Ya.; Khramova, O,D.; Cherebilo, Ye.A.; Lotin, A.A.; Wenzel, C.; Trumpaicka, N.; Bartha, J.W.: Characterization of ZnO:Ga and ZnO:N films prepared by PLD. In: Conference Program, Siofok, Hungary, September 13-18, 2008. Proceedings Laser Physics (2008)

Ostermay, I.; Kammler, T.; Naumann, A.; Bartha, J.W.; Kuecher, P.: Investigation of the relaxation behavior of Si1-xCx alloys during epitaxal UHV-CVD growth. In: Materials Science and Engineering B 154-155 (2008), S. 90–94

Liske, R. ; Preusse, A. ; Wehner, S. ; Kuecher, P. ; Bartha, J.W.: Electrochemical Cu Deposition in sub-100-nm Interconnects - Results for a new Model. In: Advanced Metallization Conference, Sept. 22-24, San Diego, USA (2008)

Keil, K.; Choi, K.-H.; Hohle, C.; Kretz, J.; Szikszai, L.; Bartha, J.W.: Detailed characterization of HSQ for e-beam application in DRAM pilot line environment. In: EIPBN, Portland, Oregon, USA (2008)

Nobis, C.; Klaus, C.; Hiemann, H.; Rudolf, F.; Wenzel, C.; Bartha, J.W.: Preparation and Investigation of Thin Coated Au and Cu Wires for US Wedge Wedge Bonding at Room Temperature. In: Semiconductor Conference Dresden, 23.-24.04.08 CD (2008)

Viehweger, K.; Richter, K.; Künzelmann, U.; Wojcik, H.; Merkel, U.; Hiess, A.; Jahn, A.; Wenzel, C.; Bartha, J.W.: Through Silicon Contacts for IC and Sensoric Application. In: Semiconductor Conference Dresden, 23.-24.04.08 CD (2008)

H., Wojcik; S., Strehle; M., Knaut; R., Kaltofen; T.M., Pletea; J., He; U., Merkel; C., Wenzel; J.W., Bartha; A., Preusse: Cu alloy and Cu bilayer adhesion studies on PEALD Ta-C-N using Al, Ag, Ru and Ta. In: Proc. of Advanced Metallization Conference (AMC 2008), San Diego, CA, September 2008 (2008)

Hoßbach, C.; Schönberger, A.; Teichert, S.; Wilde, L.; Gluch, J.; Menzel, S.; Hintze, B.; Albert, M.; Bartha, J.W.: Metalorganic Atomic Layer Deposition of low-resistive and highly conformal Ta-N-C thin films. In: AVS ALD 2008, 01.7.2008, Brügge, Belgien (2008)

Hoßbach, C.; Menzel, S.; Thomas, J.; Teichert, S.; Hintze, B.; Wilde, L.; Schmidt, D.; Albert, M.; Bartha, J.W.: Plasma-Enhanced Atomic Layer Deposition of High Quality Tantalum Carbonitride Thin Films. In: MAM-Conference 2008, 3.3.2008, Dresden (2008)

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Martin Knaut
Last modified: Oct 05, 2022