27.06.2023
Vortrag Rozalia Beica von AT&S am 28.06.2023
Expertin in der Halbleiter- und Advanced Packaging-Community und VP Strategic Marketing & Business Development von AT&S Rozalia Beica, lädt ein zu Ihrem Vortrag an der TUD.
Titel: The Growth of Heterogeneous Integration & Advanced Interconnect Technologies
Wann: Mittwoch, 28.06.2023 von 14:00 bis 14:30+ Uhr
Wo: Werner-Hartmann-Bau, Nöthnitzerstrasse 66, Raum 205/206
Inhalt zum Vortrag: We are part of a fascinating industry that continues to grow, providing numerous opportunities to innovate. The explosive growth in data generated and computing needs, global network traffic and digital transformation, connected devices, electrification and autonomous driving are further driving the growth of semiconductor industry and advanced packaging technologies. New computing and memory architectures are being developed, chiplet adoption is growing, AI functionality is being brought into the system, a wide range of sensors are being deployed across various applications to connect and make devices smarter, faster, more performing and efficient.
While significant advancements have been achieved in the past decades, especially at the device level, driven by Moore’s Law, due to high cost and longer development times needed to further advance the technology node, as well as added complexities bringing more functionalities within a system, a most holistic approach is required, at the system level, where packaging is not an afterthought anymore, instead it is now included and considered from the early stage of the system design. In the past decade, the importance of advanced packaging and heterogeneous integration technologies have significantly increased across a variety of applications, from mobile to high end computing in data center, cloud computing and networking applications, and more recently in automotive and industrial applications as well.
The presentation will focus on global market trends highlighting the major semiconductor industry trends and applications, the growth of Advanced Packaging and Heterogeneous Integration and the increasing importance of advanced interconnect technologies, highlighting the substrate technology solutions that AT&S is bringing to the market.
Biografie: Rozalia Beica is currently VP Strategic Marketing & Business Development with AT&S, located in Penang, Malaysia, leading strategic activities for Microelectronics Business Unit. Prior to AT&S she had several global executive roles in various functions (research, strategy, business development, marketing, operations and general management) and organizations across the supply chain: electronic materials (Rohm and Haas Electronic Materials, Dow Chemical & DuPont in US), equipment (Semitool and Applied Materials in US, Lam Research in Austria), device manufacturing (Maxim IC in US), market research & strategy consulting firm (Yole Developpement in France) and OEM (NCR in Canada).
Rozalia is actively involved in various industry activities. Past & current activities include: Member of the Board of Governors for IEEE Electronics Packaging Society, ECTC Executive Committee member, General Chair of 2022 ECTC (currently Sr. Past General Chair), Chair of the Heterogeneous Integration Roadmap WLP Technical Working Group, Executive Chair of System in Package China Symposium, Advisory Board Member 3DinCites and IMPACT Taiwan, IMAPS VP of Technology, General Chair IMAPS DPC, Program Director EMC3D Consortia, General Chair Global Semi & Electronics Forum, Technical Advisory Board Member SRC, Chair of the SEMI Strategic Materials Conference, and several other committee memberships. Rozalia has over 175 presentations & publications, including 3 book chapters on 3D Integration and received several industry awards including 2006 R&D 100 Award for development of SnAgCu electroplating technology for wafer bumping and IMAPS 2020 Leadership Award.
Rozalia has a M.Sc in Chemical Engineering from Polytechnic University Timisoara (Romania), a M. Sc. In Management of Technology from KWU (USA) and a Global Executive MBA from IE Business School (Spain) in partnership with Brown University (USA), Fudan University (China) and Insper University (Brazil).