The main research focus of the project is the integration of components of communication transceivers into the high performance package. The work program is divided into two research areas: electro-optical integration and packaging for mm-wave communication. Embedding and integration of link components on the wafer-level will be investigated in order to support the 3D stacking. For high pin count, optical I/O wafer-level coupling optics will be developed. To address the new integrated photonic devices, the re-development of onboard integrated waveguides (single mode, telecom wavelengths) will be addressed.

Role within the CRC 912

 A01:
o Share of 130 nm SiGe BiCMOS technology, model evaluation and overall design flow experience/know-how
o Share of device characterization infrastructure
o DC board design, assembly and testing
 A02:
o Evaluation of FPGA use for connection of the optical demonstrator with the HAEC playground
 A04:
o Discussion and exchange of optical link performance parameters, specifications and component geometries for modeling the optical connection in the HAEC Box
 A06:
o Lab support for measuring the 100 Gb/s TIA
 A10:
o Work on optical VCSEL-based demonstrator concept and setup
 A11:
o Discussion about co-integration of modulator and driver designs
o Specification of target parameters for the modulator and driver
 B06:
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o Discussions on and exchange of optical link IC parameters and conditions for developing a stochastic model to estimate the

Staff

Principal Investigator

• Prof. Karlheinz Bock

Postdoc

• Dr.-Ing. Krzysztof Nieweglowski
• Dr.-Ing. Gerald Hielscher

Technicians

• Mr. Frank Schumann