Reasearch profiles
Faculty's research encompasses the whole field of electrical engineering and information technology with a special focus on:
Table of contents
Automation, Measurement & Control
Prof. Dr.-Ing. habil. Leon Urbas
Telephone: +49 351 463-39614
- Digital Transformation of Process Industries (Modularization, Open Architectures, Integrated Engineering)
- Semantic Information Integration Technologies (Smart Data, Co-Simulation, Real Time Semantics)
- Human-Technology-Cooperation (Assistance Systems, Digital Companion Technologies, UX)
Communications Engineering
Prof. Dr.-Ing. Dr. h.c. Gerhard Fettweis
Tel.: +49 351 463 41000
- Algorithms for modulation, coding and synchronization of mobile radio channels
- Efficiency studies of multicellular radio systems
- Algorithms and concepts for the realization of the tactile Internet
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Methods and tools for the development of digital signal processors
- Embedded multiprocessor systems
Electrical Power Engineering
Prof. Dr.-Ing. Steffen Bernet
Telephone: +49-351-463-42137
- Power semiconductors including control
- Power converters
- Switched mode power supplies
- Control of converters and drives
- Power electronic systems for industrial drives, regenerative energy sources, electrotechnology (e.g. laser, welding, plasma) and traction
Electromechanical and Biomedical Systems
Prof. Dr.-Ing. Dr. h. c. Karlheinz Bock (Inhaber der Professur)
Tel.: (0351) 463 36345
apl. Prof. Dr.-Ing. habil. Thomas Zerna
Tel.: (0351) 463 33274
- Thick-film technology and photonic packaging
- Assembly, quality management and optimization of production processes
- Non-destructive inspect
- Bio-compatible electronics packaging and micro interconnect technologies
- ion and reliability evaluation
- 3D system integration
Prof. Dr.-Ing. habil. Hagen Malberg
Tel.: +49 351 463-35040
- Biomedical devices for diagnosis and prevention of life-threatening cardiovascular diseases, telemedicine
- Technical function support in biomedical systems at cell, tissue and organ level
- Multimodal image processing and autostereoscopic visualization and navigation
- Non-invasive measuring systems for biomechanical analysis of body movement and innovative rehabilitation technology in orthopedics
Information Electronics
Prof. Dr.-Ing. habil. Hagen Malberg
Tel.: +49 351 463-35040
- Biomedical devices for diagnosis and prevention of life-threatening cardiovascular diseases, telemedicine
- Technical function support in biomedical systems at cell, tissue and organ level
- Multimodal image processing and autostereoscopic visualization and navigation
- Non-invasive measuring systems for biomechanical analysis of body movement and innovative rehabilitation technology in orthopedics
Prof. Dr.-Ing. habil. Christian Georg Mayr
Tel.: +49 351 463-42392
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Ultra-low-power Multi-Processor-Systems-on-Chip (MPSoCs) in deep-submicron technologies, for applications in automotive, Internet-of-Things, industry 4.0 areas
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Bio-inspired (neuromorphic) circuit design and high-density neural implants
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Analogue circuit design of System-on-Chip components: clocking, AD
converters, sensor/actor interfaces, power management, etc.
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Machine learning and sensor processing in hardware
Prof. Dr. sc. techn. habil. Dipl. Betriebswissenschaften Frank Ellinger
Tel.: +49 351 463-38735
- Design of integrated analogue and mixed-signal circuits (ICs) and systems in advanced CMOS, BiCMOS and Beyond Moore technologies
- High-frequency ICs for wireless communication in the range of 0.1 - 220 GHz and up to 100 Gb/s
- Very power efficient adaptive circuits
- ICs and architectures for multiple intelligent antenna systems
- Very fast ICs for optical data transmission up to 100 Gbit/s
- Hybrid positioning systems based on FMCW radar, GPS, inertial sensors etc.
- Flexible and stretchable circuits in thin-film technology and organic electronics
Micro-Opto-Nano Electronics
Prof. Dr.-Ing. Dr. h. c. Karlheinz Bock (Inhaber der Professur)
Tel.: (0351) 463 36345
apl. Prof. Dr.-Ing. habil. Thomas Zerna
Tel.: (0351) 463 33274
- Thick-film technology and photonic packaging
- Assembly, quality management and optimization of production processes
- Non-destructive inspect
- Bio-compatible electronics packaging and micro interconnect technologies
- ion and reliability evaluation
- 3D system integration